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FEMC008GSTE9-T14-27
Flash Memory, MLC NAND, 8 GB, 8G x 8bit, eMMC 5.1, FBGA, 153 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerFLEXXON
Manufacturer Part NoFEMC008GSTE9-T14-27
Newark Part No.97AK3890
Product Range3.3V eMMC NAND Flash Memories
Technical Datasheet
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| Quantity | Price |
|---|---|
| 1+ | $33.710 |
| 5+ | $31.970 |
| 10+ | $30.220 |
| 25+ | $28.440 |
| 50+ | $26.540 |
| 100+ | $25.960 |
| 250+ | $25.120 |
Price for:Each
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Multiple: 1
$33.71
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Product Information
ManufacturerFLEXXON
Manufacturer Part NoFEMC008GSTE9-T14-27
Newark Part No.97AK3890
Product Range3.3V eMMC NAND Flash Memories
Technical Datasheet
Flash Memory TypeMLC NAND
Memory Density8GB
Memory Configuration8G x 8bit
InterfaceseMMC 5.1
IC Case / PackageFBGA
No. of Pins153Pins
Clock Frequency Max200MHz
Access Time-
Supply Voltage Min2.7V
Supply Voltage Max3.6V
Supply Voltage Nom3.3V
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max85°C
Product Range3.3V eMMC NAND Flash Memories
SVHCTo Be Advised
Product Overview
FEMC008GSTE9-T14-27 is a XTRA III series Pseudo SLC, industrial eMMC 5.1 flash memory. It fully complies with JEDEC eMMC5.1 standard. It is a combination of an embedded flash controller and standard MLC NAND flash memory in one JEDEC standard package. It provides high performance, good reliability, and advanced power management. It is suitable for small, low-power electronic devices.
- 8GB capacity, VCCQ: 1.8V/3.3V, VCC: 3.3V power system
- Compliant with eMMC specification Ver. 4.3, 4.4, 4.41, 4.5, 4.51, 5.0, 5.1
- High-speed eMMC protocol, clock frequency range from 0 to 200MHz
- Supports three data bus widths: 1bit (default), 4bits, 8bits
- Supports high speed mode HS400, supports production state awareness
- Supports field firmware update
- Supply voltage (NAND) range from 2.7 to 3.6V, 1.125V/ns min slew rate (with respect to VIH/VIL)
- Clock rise time is 3ns max (CL ≤30pF), clock fall time is 3ns max (CL ≤30pF)
- Output delay time during data transfer is 13.7ns max (CL ≤30 pF)
- 153-ball FBGA package, operation temperature range from -40°C to 85°C
Technical Specifications
Flash Memory Type
MLC NAND
Memory Configuration
8G x 8bit
IC Case / Package
FBGA
Clock Frequency Max
200MHz
Supply Voltage Min
2.7V
Supply Voltage Nom
3.3V
Operating Temperature Min
-40°C
Product Range
3.3V eMMC NAND Flash Memories
Memory Density
8GB
Interfaces
eMMC 5.1
No. of Pins
153Pins
Access Time
-
Supply Voltage Max
3.6V
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
To Be Advised
Technical Docs (1)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:To Be Advised
Download Product Compliance Certificate
Product Compliance Certificate