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374424B00035G
Heat Sink, Square, PCB, For Ball Grid Arrays, 20.3 °C/W, BGA, 27 mm, 18.03 mm, 27 mm
Image is for illustrative purposes only. Please refer to product description.
Available to Order
Manufacturer Standard Lead Time: 16 week(s)
Product Information
ManufacturerBOYD
Manufacturer Part No374424B00035G
Newark Part No.18M8052
Thermal Resistance20.3°C/W
Packages CooledBGA
External Width - Metric27mm
External Height - Metric18.03mm
External Length - Metric27mm
External Diameter - Metric-
Heat Sink MaterialAluminum
External Width - Imperial1.06"
External Height - Imperial0.71"
External Length - Imperial1.06"
External Diameter - Imperial-
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
- Tape mounting saves board space by eliminating mounting holes
- Convenient peel and stick assembly is quick and clean
- Pin-Fin array allows omni-directional airflow to maximize heat dissipation
- Fin dimensions (LxW): 8x8mm
Technical Specifications
Thermal Resistance
20.3°C/W
External Width - Metric
27mm
External Length - Metric
27mm
Heat Sink Material
Aluminum
External Height - Imperial
0.71"
External Diameter - Imperial
-
SVHC
No SVHC (17-Dec-2015)
Packages Cooled
BGA
External Height - Metric
18.03mm
External Diameter - Metric
-
External Width - Imperial
1.06"
External Length - Imperial
1.06"
Product Range
-
Associated Products
2 Products Found
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate