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BOND PLY TBP 850
Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "
Image is for illustrative purposes only. Please refer to product description.
192 In Stock
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181 Delivery in 2-4 Business Days(UK stock)
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| Quantity | Price |
|---|---|
| 1+ | $14.880 |
| 5+ | $13.500 |
| 10+ | $13.210 |
| 25+ | $12.910 |
| 50+ | $12.220 |
| 100+ | $10.960 |
Price for:Pack of 10
Minimum: 1
Multiple: 1
$14.88
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Product Information
ManufacturerBERGQUIST
Manufacturer Part NoBOND PLY TBP 850
Newark Part No.18K5356
Technical Datasheet
Thermal Conductivity0.8W/m.K
Conductive Material-
Thickness0.005"
Thermal Impedance-
Dielectric Strength-
External Length25.4mm
External Width25.4mm
Product Range-
SVHCNo SVHC (07-Nov-2024)
Product Overview
- Can be used to mount heat sink onto a graphics/ drive processor or heat spreader onto a PCB
- Thermal impedance: 0.86℃ - in²/W (@ 100 psi)
- High bond strength to a variety of surfaces
- Double-sided pressure sensitive adhesive tape
- High performance, thermally conductive acrylic adhesive
- Can be used instead of heat cure adhesive, screw mounting or clip mounting
Technical Specifications
Thermal Conductivity
0.8W/m.K
Thickness
0.005"
Dielectric Strength
-
External Width
25.4mm
SVHC
No SVHC (07-Nov-2024)
Conductive Material
-
Thermal Impedance
-
External Length
25.4mm
Product Range
-
Technical Docs (2)
Associated Products
1 Product Found
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:To be advised
SVHC:No SVHC (07-Nov-2024)
Download Product Compliance Certificate
Product Compliance Certificate