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374724B60024G
Heat Sink, For Ball Grid Array, 15.3 °C/W, BGA, 35 mm, 17.78 mm, 35.6 mm
Image is for illustrative purposes only. Please refer to product description.
Available to Order
Manufacturer Standard Lead Time: 16 week(s)
| Quantity | Price |
|---|---|
| 250+ | $5.470 |
Price for:Each
Minimum: 840
Multiple: 168
$4,594.80
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Product Information
ManufacturerBOYD
Manufacturer Part No374724B60024G
Newark Part No.41R3499
Technical Datasheet
Thermal Resistance15.3°C/W
Packages CooledBGA
External Width - Metric35mm
External Height - Metric17.78mm
External Length - Metric35.6mm
External Diameter - Metric-
Heat Sink MaterialAluminum
External Width - Imperial1.4"
External Height - Imperial0.7"
External Length - Imperial1.38"
External Diameter - Imperial-
Product Range-
Product Overview
The 374724B60024G is a silver solder-anchor Heat Sink for use with FPGA/BGA packages. It is made of aluminium with black anodize finish.
- Solder anchors provide the most rugged mounting in the industry
- Simple tool-free installation
- Minimal PC board real estate is required for mounting
- Lip design allows for easy removal in case of rework
- Pin-fin array allows omnidirectional airflow to maximize heat dissipation
- Comes with T766 chomerics phase change for all surfaces
Applications
HVAC, Thermal Management
Notes
Requires two anchors.
Technical Specifications
Thermal Resistance
15.3°C/W
External Width - Metric
35mm
External Length - Metric
35.6mm
Heat Sink Material
Aluminum
External Height - Imperial
0.7"
External Diameter - Imperial
-
SVHC
No SVHC (15-Jan-2019)
Packages Cooled
BGA
External Height - Metric
17.78mm
External Diameter - Metric
-
External Width - Imperial
1.4"
External Length - Imperial
1.38"
Product Range
-
Technical Docs (1)
Associated Products
3 Products Found
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (15-Jan-2019)
Download Product Compliance Certificate
Product Compliance Certificate