50-1-25

The 50-1-25 from Chemtronics is a Soder-Wick rosin desoldering braid in 1 spool. This Soder-Wick offers the state of the art in desoldering technology. It is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. Soder-Wick rosin safely removes solder in all applications requiring type ROL0 rosin flux, BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. It meets MIL-F-14256F, type R NASA-STD-8739.3, DOD-STD-883E, method 2022 ANSI/IPC J STD-004, type ROL0 Bellcore TR-NWT-000078, ANSI/IPC J SF-818, MIL-STD-2000A, MIL-B-81705C, MIL-STD-1686C and MIL-HDBK-263B standards.

• 0.030"/0.8mm width, 25'/7.5m length
• Rosin white label on spool
• Minimizes the risk of damage associated with static electricity
• Noncorrosive ultra high purity type R rosin flux
• Minimizes the risk of heat damage to the board
• Will not leave ionic contamination on the boards
• Shelf life of 2 years