50-2-25

The 50-2-25 is a Soder-Wick® Rosin Desoldering Braid offers the state of the art in desoldering technology. It is designed for today's heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. The Soder-Wick® rosin safely removes solder in all applications requiring type ROL0 rosin flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® rosin packaged in ESD-safe static dissipative bobbins.

• Yellow label on spool
• Minimizes the risk of damage associated with static electricity
• Non-corrosive ultra high purity type R rosin flux
• Minimizes the risk of heat damage to the board
• Will not leave ionic contamination on the boards

Applications

Maintenance & Repair