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                    • New Deals
                      1. Home
                      2. Semiconductors - ICs
                      3. Memory
                      4. DRAM
                      Print Page

                      S80KS5123GABHB020

                      DRAM, HyperRAM, 512 Mbit, 64M x 8bit, 200 MHz, FBGA, 24 Pins

                      INFINEON S80KS5123GABHB020
                      Image is for illustrative purposes only. Please refer to product description.
                      ManufacturerINFINEON
                      Manufacturer Part NoS80KS5123GABHB020
                      Newark Part No.29AK8419
                      Technical Datasheet

                      Data Sheet

                      See all Technical Docs
                      22 In Stock

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                      Price for:Each
                      Minimum: 1
                      Multiple: 1
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                      Product Information

                      ManufacturerINFINEON
                      Manufacturer Part NoS80KS5123GABHB020
                      Newark Part No.29AK8419
                      Technical Datasheet

                      Data Sheet

                      DRAM TypeHyperRAM
                      Memory Density512Mbit
                      DRAM Density512Mbit
                      Memory Configuration64M x 8bit
                      Clock Frequency200MHz
                      Clock Frequency Max200MHz
                      Memory Case StyleFBGA
                      IC Case / PackageFBGA
                      No. of Pins24Pins
                      Supply Voltage Nom1.8V
                      Access Time35ns
                      IC MountingSurface Mount
                      Operating Temperature Min-40°C
                      Operating Temperature Max105°C
                      Product Range-
                      MSL-
                      SVHCNo SVHC (21-Jan-2025)

                      Product Overview

                      S80KS5123GABHB020 is a HYPERRAM™ self-refresh dynamic RAM (DRAM) with Octal xSPI interface. The DRAM array uses dynamic cells that require periodic refresh. Refresh control logic within the device manages the refresh operations on the DRAM array when the memory is not being actively read or written by the xSPI interface host. Since the host is not required to manage any refresh operations, the DRAM array appears to the host as though the memory uses static cells that retain data without refresh. Hence, the memory is more accurately described as pseudo-static RAM (PSRAM). Since the DRAM cells cannot be refreshed during a read or write transaction, there is a requirement that the host limit read or write burst transfer lengths to allow internal logic refresh operations when they are needed. The host must confine the duration of transactions and allow additional initial access latency at the beginning of a new transaction, if the memory indicates a refresh operation is needed.

                      • 1.8V Interface support, single ended clock (CK) - 11 bus signals
                      • Bidirectional read-write data strobe (RWDS), output during read transactions as read data strobe
                      • Output at the start of all transactions to indicate refresh latency
                      • Input during write transactions as write data mask
                      • 200MHz maximum clock rate
                      • Maximum access time, (tACC) is 35ns
                      • VCC power supply range from 1.7 to 2V
                      • 512Mb density
                      • 24-ball FBGA package
                      • Automotive, AEC-Q100 grade 2 (-40°C to +105°C) temperature range

                      Technical Specifications

                      DRAM Type

                      HyperRAM

                      DRAM Density

                      512Mbit

                      Clock Frequency

                      200MHz

                      Memory Case Style

                      FBGA

                      No. of Pins

                      24Pins

                      Access Time

                      35ns

                      Operating Temperature Min

                      -40°C

                      Product Range

                      -

                      SVHC

                      No SVHC (21-Jan-2025)

                      Memory Density

                      512Mbit

                      Memory Configuration

                      64M x 8bit

                      Clock Frequency Max

                      200MHz

                      IC Case / Package

                      FBGA

                      Supply Voltage Nom

                      1.8V

                      IC Mounting

                      Surface Mount

                      Operating Temperature Max

                      105°C

                      MSL

                      -

                      Technical Docs (1)

                      Technical Data Sheet EN

                      Legislation and Environmental

                      US ECCN:3A991B2A
                      EU ECCN:Unknown
                      RoHS Compliant:Yes

                      RoHS

                      RoHS Phthalates Compliant:Yes

                      RoHS

                      SVHC:No SVHC (21-Jan-2025)
                      Download Product Compliance Certificate

                      Product Compliance Certificate

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