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Product Information
ManufacturerMICRON
Manufacturer Part NoMT41K256M8DA-107:K
Newark Part No.83AH2727
Technical Datasheet
DRAM TypeDDR3L
Memory Density2Gbit
DRAM Density2Gbit
Memory Configuration256M x 8bit
DRAM Memory Configuration256M x 8bit
Clock Frequency933MHz
Clock Frequency Max933MHz
IC Case / PackageFBGA
Memory Case StyleFBGA
No. of Pins78Pins
Supply Voltage Nom1.35V
IC MountingSurface Mount
Access Time1.071ns
Operating Temperature Min0°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
- DDR3L SDRAM
- 256 Meg (32) x 8 x 8 banks configuration, tCK = 1.071ns, CL = 13 speed grade
- 8K refresh count, 32KA[14:0] row address, 8BA[2:0] bank address, 1KA[9:0] column address
- VDD = VDDQ = 1.35V (1.283 to 1.45V)
- Backward-compatible to VDD = VDDQ = 1.5V ±0.075V
- Differential bidirectional data strobe, 8n-bit prefetch architecture
- Differential clock inputs (CK, CK#), 8 internal banks
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Programmable CAS (READ) latency, programmable posted CAS additive latency
- 78-ball FBGA package, commercial temperature range from 0 to +95°C
Technical Specifications
DRAM Type
DDR3L
DRAM Density
2Gbit
DRAM Memory Configuration
256M x 8bit
Clock Frequency Max
933MHz
Memory Case Style
FBGA
Supply Voltage Nom
1.35V
Access Time
1.071ns
Operating Temperature Max
95°C
MSL
MSL 3 - 168 hours
Memory Density
2Gbit
Memory Configuration
256M x 8bit
Clock Frequency
933MHz
IC Case / Package
FBGA
No. of Pins
78Pins
IC Mounting
Surface Mount
Operating Temperature Min
0°C
Product Range
-
SVHC
No SVHC (17-Dec-2015)
Technical Docs (2)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate