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MT53E768M32D2ZW-046 AUT:C
DRAM, Mobile LPDDR4, 24 Gbit, 768M x 32bit, 2.133 GHz, TFBGA, 200 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerMICRON
Manufacturer Part NoMT53E768M32D2ZW-046 AUT:C
Newark Part No.63AK7039
Technical Datasheet
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| Quantity | Price |
|---|---|
| 1+ | $28.230 |
| 5+ | $28.230 |
| 10+ | $28.230 |
| 25+ | $28.230 |
| 50+ | $28.230 |
| 100+ | $28.230 |
| 250+ | $28.230 |
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Multiple: 1
$28.23
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E768M32D2ZW-046 AUT:C
Newark Part No.63AK7039
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density24Gbit
Memory Configuration768M x 32bit
Clock Frequency Max2.133GHz
IC Case / PackageTFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max125°C
Product Range-
MSLMSL 3 - 168 hours
SVHCNo SVHC (17-Dec-2015)
Product Overview
MT53E768M32D2ZW-046 AUT:C is a mobile LPDDR4 SDRAM. The 12Gb mobile low-power DDR4 SDRAM with low VDDQ (LPDDR4X) is a high-speed, CMOS dynamic random-access memory device. This device is internally configured with 1 channel ×16 I/O, having 8-banks.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate, partial-array self refresh (PASR)
- Selectable output drive strength (DS), clock-stop capability, AEC-Q100 automotive grade
- Programmable VSS (ODT) termination, single-ended CK and DQS support
- Operating voltage is 1.10V VDD2/0.60V VDDQ or 1.10V VDDQ, 468ps cycle time
- 3GB (24Gb) total density, 4266Mb/s data rate per pin
- Operating temperature range from -40°C to +125°C, 200-ball TFBGA package
Technical Specifications
DRAM Type
Mobile LPDDR4
Memory Configuration
768M x 32bit
IC Case / Package
TFBGA
Supply Voltage Nom
1.1V
Operating Temperature Min
-40°C
Product Range
-
SVHC
No SVHC (17-Dec-2015)
Memory Density
24Gbit
Clock Frequency Max
2.133GHz
No. of Pins
200Pins
IC Mounting
Surface Mount
Operating Temperature Max
125°C
MSL
MSL 3 - 168 hours
Technical Docs (1)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate