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ManufacturerMICRON
Manufacturer Part NoMT62F3G32D8DV-023 AIT:B
Newark Part No.25AK8021
Technical Datasheet
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F3G32D8DV-023 AIT:B
Newark Part No.25AK8021
Technical Datasheet
DRAM TypeLPDDR5
Memory Density96Gbit
DRAM Density96Gbit
Memory Configuration3G x 32bit
DRAM Memory Configuration3G x 32bit
Clock Frequency Max4.266GHz
Clock Frequency-
IC Case / PackageFBGA
Memory Case StyleFBGA
No. of Pins315Pins
Supply Voltage Nom-
IC MountingSurface Mount
Access Time-
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
Product Overview
MT62F3G32D8DV-023 AIT:B is a LPDDR5X SDRAM.
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
- Frequency range: 1067–5MHz (data rate range per pin: 8533–40Mb/s with WCK:CK = 4:1)
- Single x16 channel/die, double-data-rate command/address entry
- Differential command clocks (CK-t/CK-c) for high-speed operation
- Differential data clocks (WCK-t/WCK-c), background ZQ calibration/command-based ZQ calibration
- Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- 3Gb x 32 (1536Mb8 x 2 die x 2Ch x 2R) array configuration
- 315-ball LFBGA package
- Operating temperature range from -40°C to +95°C
Technical Specifications
DRAM Type
LPDDR5
DRAM Density
96Gbit
DRAM Memory Configuration
3G x 32bit
Clock Frequency
-
Memory Case Style
FBGA
Supply Voltage Nom
-
Access Time
-
Operating Temperature Max
95°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
96Gbit
Memory Configuration
3G x 32bit
Clock Frequency Max
4.266GHz
IC Case / Package
FBGA
No. of Pins
315Pins
IC Mounting
Surface Mount
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate