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ManufacturerMICRON
Manufacturer Part NoMT62F768M32D2DS-023 AAT:B
Newark Part No.48AK5504
Technical Datasheet
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F768M32D2DS-023 AAT:B
Newark Part No.48AK5504
Technical Datasheet
DRAM TypeLPDDR5
Memory Density24Gbit
DRAM Density24Gbit
DRAM Memory Configuration768M x 32bit
Memory Configuration768M x 32bit
Clock Frequency-
Clock Frequency Max-
Memory Case StyleFBGA
IC Case / PackageFBGA
No. of Pins-
Supply Voltage Nom-
Access Time-
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max105°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
- Mobile LPDDR5/LPDDR5X SDRAM
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1) architecture
- Background ZQ calibration/command-based ZQ calibration, link protection (link ECC) support
- I/O type: Low-swing single-ended, VSS terminated, VOH-compensated output drive, DVFSQ support
- Dynamic voltage frequency scaling core, single-ended CK, single-ended WCK, and single-ended RDQS
- Operating voltage is 1.05V VDD2H / 0.5V VDDQ
- 768 Meg x 32 configuration, 2 die
- 315-ball TFBGA package
- 3GB (24Gb) total density, 8533Mb/s data rate per pin
- AEC-Q100 automotive qualified, -40°C ≤ TC ≤ +105°C operating temperature
Technical Specifications
DRAM Type
LPDDR5
DRAM Density
24Gbit
Memory Configuration
768M x 32bit
Clock Frequency Max
-
IC Case / Package
FBGA
Supply Voltage Nom
-
IC Mounting
Surface Mount
Operating Temperature Max
105°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
24Gbit
DRAM Memory Configuration
768M x 32bit
Clock Frequency
-
Memory Case Style
FBGA
No. of Pins
-
Access Time
-
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate