Newark introduces protective peel packaging for Integrated Circuits
CHICAGO-May 7, 2008
Exclusive patent-pending process a part of electronics distributor's initiative to develop best-in-class packaging for entire offering
Committed to bringing design engineers the newest technologies first, leading multi-channel electronics distributor Newark, part of the global Premier Farnell Group, has launched an innovative peel packaging solution for the North American market, designed to protect fragile integrated circuits (ICs) during shipping, storing, and handling.
Currently, this new solution is available for ICs with case sizes measuring 12mm x 12mm and 14mm x 14mm. The ICs are placed within protective recyclable plastic cells, which are then sealed with an anti-static lid. Offered at no extra charge, peel packaging provides a reduced risk of moisture ingress and easy product identification: Newark's stock number and the manufacturer's part number are clearly marked on the back of the package.
Prior to implementing peel packaging, Newark conducted extensive customer research, which concluded that no single packaging solution works best for every IC size, shape, and pin configuration. The research also confirmed that cut tape remains the preferred choice for most smaller-sized IC devices, and Newark will soon expand its product range available in this format.
"We've learned that innovation and versatility trumps a 'one size fits all' approach when it comes to packaging ICs", comments Paul Buckley, Senior Vice President, Product & Supplier Management. "And as a Premier Farnell company, we are committed to further improving packaging materials for our entire offering."
The patent-pending peel packaging was developed in-house, in partnership with Newark's sister European business, Farnell, and Antistat, a company providing supply chain and packaging solutions to the electronics, medical, and automotive markets.