Print Page
Image is for illustrative purposes only. Please refer to product description.
ManufacturerMICRON
Manufacturer Part NoMT46H32M32LFB5-5 IT:B
Newark Part No.80AH8094
Technical Datasheet
365 In Stock
Need more?
Same day shipping
Order before 9pm EST standard shipping
Quantity | Price |
---|---|
1+ | $4.640 |
10+ | $4.640 |
25+ | $4.640 |
50+ | $4.640 |
100+ | $4.640 |
250+ | $4.640 |
500+ | $4.640 |
Price for:Each
Minimum: 1
Multiple: 1
$4.64
Enter Your Part No/Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
This number will be added to the Order Confirmation, Invoice, Dispatch note, Web confirmation Email and Product Label.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT46H32M32LFB5-5 IT:B
Newark Part No.80AH8094
Technical Datasheet
DRAM TypeMobile LPDDR
DRAM Density1Gbit
Memory Density1Gbit
DRAM Memory Configuration32M x 32bit
Memory Configuration32M x 32bit
Clock Frequency200MHz
Clock Frequency Max200MHz
IC Case / PackageVFBGA
Memory Case StyleVFBGA
No. of Pins90Pins
Supply Voltage Nom1.8V
IC MountingSurface Mount
Access Time5ns
Operating Temperature Min-40°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT46H32M32LFB5-5 IT:B is a mobile low-power DDR SDRAM. It is a high-speed CMOS, dynamic random-access memory containing 1,073,741,824 bits. It is internally configured as a quad-bank DRAM. Each of the x16’s 268,435,456-bit banks are organized as 16,384 rows by 1024 columns by 16 bits. Each of the x32’s 268,435,456-bit banks are organized as 8192 rows by 1024 columns by 32 bits.
- Operating voltage range is 1.8V, deep power-down (DPD)
- 32Meg x 32 configuration, clock stop capability
- Packaging style is 90-ball (8mm x 13mm) VFBGA, “green”
- Timing (cycle time) is 5ns at CL = 3 (200 MHz), JEDEC-standard addressing
- Industrial operating temperature range is –40°C to +85°C, second generation
- Clock rate is 200MHz, bidirectional data strobe per byte of data (DQS)
- Differential clock inputs (CK and CK#), commands entered on each positive CK edge
- DQS edge-aligned with data for READs, centeraligned with data for WRITEs
- Concurrent auto precharge option is supported, auto refresh and self refresh modes
- Temperature-compensated self refresh (TCSR), partial-array self refresh (PASR)
Technical Specifications
DRAM Type
Mobile LPDDR
Memory Density
1Gbit
Memory Configuration
32M x 32bit
Clock Frequency Max
200MHz
Memory Case Style
VFBGA
Supply Voltage Nom
1.8V
Access Time
5ns
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
1Gbit
DRAM Memory Configuration
32M x 32bit
Clock Frequency
200MHz
IC Case / Package
VFBGA
No. of Pins
90Pins
IC Mounting
Surface Mount
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate