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                      1. Home
                      2. Semiconductors - ICs
                      3. Memory
                      4. DRAM
                      Print Page

                      MT48H32M16LFB4-6 IT:C

                      DRAM, Mobile LPSDR, 512 Mbit, 32M x 16bit, 166 MHz, VFBGA, 54 Pins

                      MICRON MT48H32M16LFB4-6 IT:C
                      Image is for illustrative purposes only. Please refer to product description.
                      ManufacturerMICRON
                      Manufacturer Part NoMT48H32M16LFB4-6 IT:C
                      Newark Part No.80AH8138
                      Technical Datasheet

                      Data Sheet

                      See all Technical Docs
                      1,405 In Stock

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                      Product Information

                      ManufacturerMICRON
                      Manufacturer Part NoMT48H32M16LFB4-6 IT:C
                      Newark Part No.80AH8138
                      Technical Datasheet

                      Data Sheet

                      DRAM TypeMobile LPSDR
                      Memory Density512Mbit
                      DRAM Density512Mbit
                      DRAM Memory Configuration32M x 16bit
                      Memory Configuration32M x 16bit
                      Clock Frequency Max166MHz
                      Clock Frequency166MHz
                      Memory Case StyleVFBGA
                      IC Case / PackageVFBGA
                      No. of Pins54Pins
                      Supply Voltage Nom1.8V
                      IC MountingSurface Mount
                      Access Time6ns
                      Operating Temperature Min-40°C
                      Operating Temperature Max85°C
                      Product Range-
                      MSLMSL 3 - 168 hours
                      SVHCNo SVHC (17-Jan-2023)

                      Product Overview

                      MT48H32M16LFB4-6 IT:C is a mobile LPSDR SDRAM. It is a high-speed CMOS, dynamic random-access memory containing 536,870,912bits. It is internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). This mobile LPSDR offers substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks in order to hide precharge time, and the capability to randomly change column addresses on each clock cycle during a burst access.

                      • 1.8V/1.8V operating voltage, 32 Meg x 16 configuration
                      • Standard addressing, 6ns, tCK CL = 3 cycle time
                      • Fully synchronous : all signals registered on positive edge of system clock
                      • Internal, pipelined operation; column address can be changed every clock cycle
                      • Four internal banks for concurrent operation, selectable output drive strength (DS)
                      • Auto precharge, includes concurrent auto precharge, auto refresh and self refresh modes
                      • LVTTL-compatible inputs and outputs, on-chip temperature sensor to control self refresh rate
                      • Partial-array self refresh (PASR), deep power-down (DPD)
                      • Industrial operating temperature range from -40°C to +85°C, package style is 54-ball VFBGA

                      Technical Specifications

                      DRAM Type

                      Mobile LPSDR

                      DRAM Density

                      512Mbit

                      Memory Configuration

                      32M x 16bit

                      Clock Frequency

                      166MHz

                      IC Case / Package

                      VFBGA

                      Supply Voltage Nom

                      1.8V

                      Access Time

                      6ns

                      Operating Temperature Max

                      85°C

                      MSL

                      MSL 3 - 168 hours

                      Memory Density

                      512Mbit

                      DRAM Memory Configuration

                      32M x 16bit

                      Clock Frequency Max

                      166MHz

                      Memory Case Style

                      VFBGA

                      No. of Pins

                      54Pins

                      IC Mounting

                      Surface Mount

                      Operating Temperature Min

                      -40°C

                      Product Range

                      -

                      SVHC

                      No SVHC (17-Jan-2023)

                      Technical Docs (1)

                      Technical Data Sheet EN

                      Legislation and Environmental

                      US ECCN:Unknown
                      EU ECCN:Unknown
                      RoHS Compliant:Yes

                      RoHS

                      RoHS Phthalates Compliant:Yes

                      RoHS

                      SVHC:No SVHC (17-Jan-2023)
                      Download Product Compliance Certificate

                      Product Compliance Certificate

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