XCZU7EV-1FBVB900I

XCZU7EV-1FBVB900I is a microprocessor Zynq™ UltraScale+™ MPSoC. It is based on the UltraScale™ MPSoC architecture. It delivers unprecedented processing, I/O, and memory bandwidth in the form of an optimized mix of heterogeneous processing engines embedded in a next-generation, high-performance, on-chip interconnect with appropriate on-chip memory subsystems. It is able to serve a wide range of applications, including automotive: driver assistance, driver information, and infotainment, wireless communications: support for multiple spectral bands and smart antennas, wired communications: multiple wired communications standards and context-aware network services, data centers: software defined networks (SDN), data pre-processing, and analytics, smarter vision: evolving video-processing algorithms, object detection, and analytics, connected control/M2M: flexible/adaptable manufacturing, factory throughput, quality, and safety.

• High-speed connectivity: 4 PS-GTR; PCIe Gen1/2; serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
• Graphic processing unit : Arm Mali™-400 MP2; 64KB L2 cache
• System monitor in PS: on-chip voltage and temperature sensing
• JTAG boundary-scan: IEEE Std 1149.1 compatible test interface
• Supports LVCMOS, LVDS, and SSTL, 1.0V to 3.3V I/O, programmable I/O delay and SerDes
• On-chip voltage and temperature sensing, 10bit 200KSPS ADC with up to 17 external inputs
• 504,000 system logic cells, 460,800 CLB flip-flops, 230,400 CLB LUTs
• 6.2Mb distributed RAM, 312 block RAM blocks, 11Mb block RAM
• 900-pin FCBGA package
• Industrial temperature range from -40°C to +100°C