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374624B00032G
Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 35 mm, 10.16 mm, 35.6 mm
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Product Information
ManufacturerBOYD
Manufacturer Part No374624B00032GCopy
Newark Part No.45M6206
Technical Datasheet
Thermal Resistance23.4°C/W
Packages CooledBGA
External Width - Metric35mm
External Height - Metric10.16mm
External Length - Metric35.6mm
External Diameter - Metric-
Heat Sink MaterialAluminum
External Width - Imperial1.4"
External Height - Imperial0.4"
External Length - Imperial1.38"
External Diameter - Imperial-
Product Range-
SVHCNo SVHC (15-Jan-2019)
Technical Specifications
Thermal Resistance
23.4°C/W
External Width - Metric
35mm
External Length - Metric
35.6mm
Heat Sink Material
Aluminum
External Height - Imperial
0.4"
External Diameter - Imperial
-
SVHC
No SVHC (15-Jan-2019)
Packages Cooled
BGA
External Height - Metric
10.16mm
External Diameter - Metric
-
External Width - Imperial
1.4"
External Length - Imperial
1.38"
Product Range
-
Technical Docs (1)
Associated Products
3 Products Found
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (15-Jan-2019)
Download Product Compliance Certificate
Product Compliance Certificate