60-1-10

The 60-1-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.

• White label on SD bobbin
• Minimizes the risk of damage associated with static electricity
• Patented non-corrosive, halide-free and organic no-clean flux
• Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
• Requires little or no post solder cleaning
• No corrosive residues
• Minimal risk of heat and static component damage
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
• Packaged in ESD-safe static dissipative bobbins

Applications

Maintenance & Repair