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MT41K256M8DA-125 IT:K
DRAM, DDR3L, 2 Gbit, 256M x 8bit, 800 MHz, FBGA, 78 Pins
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| Quantity | Price |
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| 1+ | $40.360 |
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT41K256M8DA-125 IT:K
Newark Part No.83AH2728
Technical Datasheet
DRAM TypeDDR3L
Memory Density2Gbit
DRAM Density2Gbit
DRAM Memory Configuration256M x 8bit
Memory Configuration256M x 8bit
Clock Frequency Max800MHz
Clock Frequency800MHz
Memory Case StyleFBGA
IC Case / PackageFBGA
No. of Pins78Pins
Supply Voltage Nom1.35V
IC MountingSurface Mount
Access Time1.25ns
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
- DDR3L SDRAM (32 Meg x 8 x 8 banks)
- 256 Meg x 8 configuration, tCK = 1.25ns, CL = 11 speed grade
- VDD = VDDQ = 1.35V (1.283 to 1.45V), backward-compatible to VDD = VDDQ = 1.5V ±0.075V
- Differential bidirectional data strobe, 8n-bit prefetch architecture
- Differential clock inputs (CK, CK#), 8 internal banks
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Programmable CAS (READ) latency (CL), programmable posted CAS additive latency (AL)
- Programmable CAS (WRITE) latency (CWL)
- Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])
- 78-ball FBGA package, industrial temperature range from -40°C ≤ TC ≤ +95°C
Technical Specifications
DRAM Type
DDR3L
DRAM Density
2Gbit
Memory Configuration
256M x 8bit
Clock Frequency
800MHz
IC Case / Package
FBGA
Supply Voltage Nom
1.35V
Access Time
1.25ns
Operating Temperature Max
95°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
2Gbit
DRAM Memory Configuration
256M x 8bit
Clock Frequency Max
800MHz
Memory Case Style
FBGA
No. of Pins
78Pins
IC Mounting
Surface Mount
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (2)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate