ARRAYC-60035-64P-PCB

ON Semiconductor’s range of C-Series, SMT (surface mount technology) SiPM sensors have been used to create compact and scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space. The ArrayC products are available in a variety of formats, and formed of pixels of different sizes. The back of each ArrayC has either one or more multi-way connectors, or a BGA (ball grid array), that allow access to the fast output and standard I/O from each pixel in the array, and a common I/O from the summed substrates of the pixels. The ArrayC products with connectors can be used to interface with the user’s own readout via the mating connector, or to ON Semiconductor’s Breakout Boards (BOBs). The BOBs allow for easy access to the pixel signals and performance evaluation of the arrays.

• 35 um (18,980 microcells)
• I/O Interface - Connector
• Array Size 8x8
• Pixel Pitch 7.2 mm