UR5048RP250G

This flexible encapsulation compound is clear amber in colour with low viscosity and low shore hardness. It can be dug out making it a choice for potting units that may require rework or repair. In most cases because of the transparency of the cured compound, the potted electronics can be easily inspected and the defect spotted. The resin can then be easily dug out in order to make the repair, without having to strip down the entire unit.<{GetAttribute ReturnCharacterConversion}><{GetAttribute ReturnCharacterConversion}>It also absorbs very little water making it an ideal choice for electronics operating in humid environments.

• Very low hardness - can be cut or dug out for easy removal
• Transparent / clear to allow fast fault finding
• Low embedment stress
• Ideal for protecting delicate components from mechanical and thermal shock
• Excellent low temperature performance; remains flexible to -60°C
• Very low water absorption; ideal for high humidity environments
• RoHS-2 Compliant